Resin sealed semiconductor device and a method for making the same

ABSTRACT

This invention provides a resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than the generator, a monolithic IC which controls an operation of the generator, mounted on a conductive member, and connected to both the first connecting terminal and the second connecting terminal and a resin molded portion of an electric insulating resin sealing the monolithic IC and at least a portion of the first and second connecting terminals are connected to the monolithic IC. 
     Whereby an IC regulator which can be effectively used with an electrical load can be obtained, and further, an IC regulator having a more reliable control performance and able to be produced at low production cost can be obtained.

This is a division of application Ser. No. 07/201,757, filed June 3,1988, now U.S. Pat. No. 4,899,209.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a resin sealed semiconductor device and amethod for making the same and is preferably applicable to an ICregulator (integrated semiconductor regulator) used as a voltageregulator, for example, as an A.C. generator acting an alternator, forvehicles.

2. Description of the Related Art

Heretofore, an IC regulator, as described in Japanese Utility ModelPublicatiion No. 57-44717, is a hybrid IC comprising a substrate (forexample, a ceramic substrate) on which ICs, transistors and chipcondensers or the like are mounted, incorporated into a shield casehaving a connector thereon, and this case is mounted on an electricalload.

However, such a hybrid increases the size of the device, and the numberof components used in this device is also increased, and therefore, manyoperational steps are required, for its assembly which will reduce thereliability of the device.

Recently, the requirements for high integration and minimized size haveincreased and consequently, for example a controlling circuit for anelectric load has been integrally incorporated with a power device forenergizing the the electric load. Such a device is reduced to amonolithic integrated circuit (IC).

There is a trend for such a monolithic IC to become more minimized,lighter and cheaper, for directly mounting the same on an electricalload.

When making such a resin sealed semiconductor device in which amonolithic IC mentioned above is incorporated, a lead frame in whicheach connecting terminal is connected to an outer frame thereof is used,to reduce the number of components used in the device and the number ofoperational steps. But, assuming that the electrical load is an A.C.generator or the like and it is necessary to control the operationthereof, the IC regulator must be in electrical contact with connectingterminals in the A.C. generator for transmitting signals back and forthand energizing current, and simultaneously, must maintain electricalcontact with a portion other than the A.C. generator for transmittingsignals back and forth and energizing current. Namely, connectingterminal for connecting to an electrical load, and other connectingterminals for connecting to an external device other than the load, aregenerally required. More specifically, such a device generally must haveconnecting terminals for connecton to the A.C. generator and connectingterminals for connecton to a device other than the A.C. generator, andfurther, must ensure that the connecting terminal connected to thedevice other than the A.C. generator is not bent by mechanical impact.

Also such a device must usually form a connector with resin by a moldingmethod because, in general, each connecting terminal has a high inputimpedance, and therefore, a water-proof construction is required.

Accordingly, it is difficult to apply the current technology, in which alead frame is used in the resin sealed semiconductor device, to thisproblem, and therefore, a resin sealed IC regulator using a lead frameis not currently available.

Therefore, solutions to these problems are required.

SUMMARY OF THE INVENTION

Accordingly, this invention was created in view of the problemsmentioned above, and therefore, the object of this invention is toprovide a semiconductor device used as a power device, and having acontrolling circuit for an electric load being integrated therewith,having a small number of the components, and able to be produced at alow cost due to a reduction of the number of process steps, and further,to provide a semiconductor package having connecting terminals and ableto be produced at a low cost by reducing the process steps in such a waythat a molding operation for forming a water proof connector housing anda sealing operation for sealing a monolithic IC are carried outsimultaneously.

Another object of this invention is to provide a device which does notrequire a special configuration for separating the connecting terminalsconnected to external portions for a resin sealed semiconductor devicehaving a connector housing molded by a connector molding method andsurrounding the connecting terminal, connected to the external portions.

A further object of this invention is to provide a method for making aresin sealed semiconductor device by which the number of components isreduced and the number of operational steps is also reduced, utilizing alead frame.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 3 show a front plane view, a back plane view, and a sectionalview of a resin sealed semiconductor device made in Example 1,respectively;

FIG. 4(a) shows a front plane view of a lead frame used in Example 1;

FIG. (4b) shows a back plane view of a lead frame on which a monolithicIC is mounted;

FIG. 5 shows a plane view of a lead frame on which a resin sealedmonolithic IC portion is molded in Example 1;

FIGS. 6 and 7 are a plane view of a heat sink and a side view of a heatsink respectively;

FIGS. 8 and 9 show a front plane view and a back plane view of a resinsealed monolithic IC portion after cutting off frame portions,respectively;

FIGS. 10 and 11 are a plane view and a side view of a fabricated portionof an end tip portion of an external connecting terminal, respectively;

FIG. 12 shows a plane view of a lead frame on which a monolithic IC ismounted in Example 2;

FIG. 13 shows a plane view of a lead frame on which a resin sealedmonolithic IC portion is molded in Example 2;

FIG. 14 and 15 are a back plane view and a side view of a lead frame onwhich a monolithic IC is mounted in Example 3, respectively;

FIGS. 16 and 17 are a front and back plane view of a resin sealedsemiconductor device in Example 4 respectively;

FIG. 18 is a sectional view taken along the line B--B in FIG. 17;

FIG. 19 shows a back plane view of a lead frame on which a monolithic ICis mounted in Example 3;

FIG. 20 shows a plane view of a lead frame on which a resin sealedmonolithic IC portion is molded;

FIGS. 21 and 22 are a front plane view and a back plane view of a resinsealed monolithic IC portion separated from a frame portion of a leadframe, respectively;

FIG. 23 ad 24 are a plane view and a sectional view of the resin sealedmonolithic IC portion shown in FIG. 21, in which external connectingterminals are bent, respactively;

FIG. 25 shows a plane view of a lead frame used in the Example 5;

FIG. 26 shows a plane view of a lead frame used in the Example 5, onwhich a monolithic IC is mounted;

FIG. 27 shows a plane view of a lead frame shown in FIG. 26, on which aresin sealed monolithic IC portion is molded;

FIG. 28 shows a plane view of a heat sink;

FIG. 29 shows a back plane view of a resin sealed monolithic IC portionseparated from a frame portion of a lead frame;

FIG. 30 is a perspective view of a resin sealed monolithic IC portionshown in FIG. 29 in which external connecting terminals are bent;

FIG. 31 is a perspective view of an IC regulator made in Example 5;

FIG. 32 is a plane view showing a configuration in which the ICregulator is mounted on an alternator;

FIG. 33 shows an electric circuit related to the IC regulator and thealternator;

FIG. 34 shows a side view of the IC regulator used in Example 5;

FIG. 35 (A) shows a plane view of a resin sealed semiconductor devicemade in Example 6;

FIGS. 35 (B) and (C) show a plane view and a side view of a heat sinkused in Example 6, respectively;

FIG. 36 shows a plane view of a lead frame used in Example 6;

FIG. 37 shows a plane view of the resin sealed semiconductor device witha connector housing molded on the lead frame shown in FIG. 36;

FIG. 38 shows a plane view of a resin sealed semiconductor device madein Example 7;

FIG. 39 shows a plane view of a lead frame used in Example 7;

FIG. 40 shows a plane view of the resin sealed semiconductor device witha connector housing molded on the lead frame; and, FIG. 41 shows anaperture portion provided on the resin sealed semiconductor device withsealing portion therein.

DESCRIPTION OF THE PREFERRED EMBODIMENT

To attain the object of this invention, the resin sealed semiconductordevice of this invention is characterized in that a resin sealedsemiconductor device, which comprises a first connecting terminalelectrically connected to an electric load, a second connecting terminalelectrically connected to a device other than the electric load, amonolithic IC which controls an operation of the load mounted on aconductive member and electrically connected to both the firstconnecting terminal and the second connecting terminal, and a resinmolded portion of an electric insulating resin sealing the monolithic ICand solidly fixing the monolithic IC and at least a portion of the firstand second connecting terminals connected to the monolithic IC.

To attain the object of this invention, the resin sealed semiconductordevice of this invention is further characterized by comprising, a firstconnecting terminal electrically connected to an electric load, a secondconnecting terminal electrically connected to a device other than theelectric load, a monolithic IC which controls an operation of theelectric load mounted on a plate and electrically connected to both thefirst connecting terminal and the second connecting terminal, a firstmolded portion in which the monolithic IC and at least a portion of thefirst and second connecting terminals connected to the monolithic IC aresealed with a first resin, and a second molded portion formed by anexternally covering molding method to cover at least a portion of thefirst molded portion externally with a second resin in such a mannerthat at least a portion of the first molded portion is held by thesecond molded portion.

The resin sealed semiconductor device of this invention is furtherspecifically characterized by comprising a connector housing made by aconnector molding method carried out simultaneously with or followingthe externally covering molding method utilizing the second resin andthe second connecting terminal is surrounded within a cavity provided inthe connector housing.

The first resin and the second resin may be the same kind of resin ormay be different kinds of resins, for example, having different chemicalcomponents, viscosity, or strength, or the like.

In this invention, the resin used as a first resin may be athermosetting resin and the second resin may be a thermoplastic resin.

The second resin may be molded in such a manner that at least a rootportion of the second connecting terminal extending outwardly from thefirst molded portion molded with the first resin is covered with thesecond resin.

Further, a contacting surface of each of the first and the second resinsis roughened, and such a roughened surface may be provided for example,with concave and convexe portions or grooves or ribs.

In another embodiment of this invention, the resin sealed semiconductordevice is characterized by comprising, a first connecting terminalelectrically connected to an electric load, a second connecting terminalelectrically connected to a device other than the electric load and bentat a predetermined angle, a monolithic IC which controls an operation ofthe electric load mounted on a plate and electrically connected to boththe first and the second connecting terminal, a heat sink made of a highthermal conductive material, a sealed monolithic IC portion in which theheat sink is fixed in proximity to the monolithic IC by molding with afirst resin and the monolithic IC and at least a portion of the firstand second connecting terminals connected to the monolithic IC aresealed together with a first resin, a molded portion formed by anexternally covering molding method with a second resin (referred to assecond molded portion) whereby at least a portion of the sealed portiondescribed above (referred to as first molded portion hereafter), iscovered with the second molded portion in such a manner that the firstmolded portion is held by the second molded portion to strengthen thecontacting force therebetween and a connector housing integrally moldedwith the second molded portion-as described above made by a connectormolding method for surrounding the second connecting terminal with asecond resin, being bent together with the second connecting terminal.

To attain the other object of this invention, the method for making theresin sealed semiconductor device is characterized by comprising,forming a lead frame in which at least a first connecting terminalelectrically connected to an electric load and a second connectingterminal connected to a device other than the electric load areconnected to a frame portion thereof, made of a plate of an electricconductive material, mounting a monolithic IC controlling an operationof the electrical load on a conductive member and electricallyconnecting the monolithic IC to the lead frame, sealing the monolithicIC mounted on the conductive member and at least a portion of the firstand second connecting terminals electrically connected to the monolithicIC with a first resin having an electric insulation characteristic,separating the frame portion from the lead frame and making a moldedportion by a molding method including an externally covering moldingmethod, or if desired, additionally by a connector molding method toprovide a connector housing surrounding the second connecting terminalwith a second resin having an electric insulation characteristic.

The most characteristic feature of this invention is the constructionthereof comprising a plurality of first connecting terminals, at leastone a second connecting terminal, a monolithic IC which controls anoperation of the electrical load mounted on a and connected to both thefirst connecting terminal and the second connecting terminal and a resinmolded portion of an electric insulating resin sealing the monolithic ICand at least a portion of the first and second connecting terminalsconnected to the monolithic IC, wherein each connecting terminal isdirectly extended from the out side of the molded portion into a portionadjacent to the monolithic IC in the molded portion in a form of singlepiece, and the extended portion of the connecting terminal is rigidlyfixed within the resin and the molded portion further comprising aconnector housing integrally mounted thereon, and surrounding the secondconnecting terminals.

In this invention, by adopting the construction described above, eachconnecting terminal can be given a suitable thickness for end use and,therefore, the strength of each connecting terminal is increased whereincontact with an opposite connecting portion. Also, if desired, a meansof fixing means for the connecting terminal to a fixing point of theanother device can be provided on the connecting terminal.

Especially, when using this device in an alternator, which is one objectof this invention, this device can be fixed in contact with theconnecting portion thereof, and vibration of the alternator whenenergized will not affect same. Further, in this construction, since oneend of the connecting terminal is located adjacent to the monolithic IC,therefore, a length of a wire for wire bonding can be considerablyreduced, and thus the production efficiency is increased because theoccurrence of defective products caused by a molding operation isgreatly reduced.

In this invention, to improve a close adherence force between the firstresin and second resin, an externally covering molding operation isadopted.

Note, "an externally covering molding method" referred to herein is amolding method in which at least a portion of the first molded portionis covered with the second molded portion in such a manner that at leasta portion of the first molded portion is held by the second moldedportion and, if desired, the externally covering molding method can becarried out simultaneously with a connector molding method to make aconnector housing surrounding the second connecting terminals, of thesame resin used for the second molded portion.

Another specific characteristic feature of this invention is that thefirst connecting terminal can be directly connected to a portion on theelectrical load and the second connecting terminal can be used as aconnector.

Namely, in this invention, the semiconductor device has at least twodifferent kind of groups of connecting terminals, in that the firstgroup is the first connecting terminals that can output or inputelectric information signal related to a control of an electrical load,and the second group is the second connecting terminal that can input anelectric information signal related to a power source to a controlcircuit of a monolithic IC and output an electric information signalrelated to a control of the electrical load.

In making such a semiconductor device, many components were used in sucha device and, therefore, a drawback aroses in that to integrally combinesuch components, an increment of the number of the components and thenumber of the process steps was required and further, another drawbackoccurred in that in such a device, many cut portions, produced bycutting a connecting portion between the terminal and the lead frame,appear on a surface of the regulator. However, these problems are alsoresolved in this invention.

EXAMPLE

Hereafter, this invention will be explained by way of examples withreference to with drawings.

EXAMPLE 1

FIG. 1 and FIG. 2A show a front plane view and a back plane view of aresin sealed semiconductor device in the Example 1 of this invention,respectively and FIG. 3 shows a cross sectional view taken along theline A--A of FIG. 2.

This resin sealed semiconductor device 1 comprises a connector housing14 including a second molded portion Y integrally molded with thehousing 14, a sealed monolithic IC portion 13, i.e., a first moldedportion X which is partially covered by the second molded portion Y,integrated with the connector housing 14 and a heat sink (heat radiatingplate) 12.

The second molded portion Y is formed by an externally covering moldingmethod to cover at least a main surface of the sealed monolithic ICportion 13, i.e., the first molded portion X, in such a manner that thefirst molded portion is held by the second molded portion and theconnector housing 14 is integrated with the second molded portion Y, isformed by connector molding method carried out simultaneously with theexternally covering molding method, and this connector housing surroundsa group of connecting terminals connected to the external separateportion, and forms a cover.

The sealed monolithic IC portion 13 is produced by a method in which themonolithic IC 16 is first mounted on a predetermined portion of a backside of the lead frame 11, as shown in FIG. 4 (a), and the monolithic IC16 and each of the connecting terminals are electrically connected bylead wires 17 to get a lead frame 11a as shown in FIG. 4 (b), andthereafter, the lead frame 11a is sealed with a resin 13a.

The lead frame 11 is made from a plate by a punching method and consistsof a frame portion, a group of connecting terminals, and a connectorportion for the heat sink; the frame portion being separated from thelead frame before the resin sealed semiconductor device is formed.

Both contacting surfaces of the resin 13a for sealing the monolithic ICand of the resin 14b for molding a connector housing, i.e., a contactingsurface between the first molded portion X and the second molded portionY, are provided with roughened surfaces: For example, a plurality ofprojected lines or ribs 131 are provided on the surface of the sealedmonolithic IC portion 13 and cause a fixed adhesion thereof with theresin 14b.

A cavity 14a, which is defined by the connector housing and it has aconstruction such that it can be connected to a female adapter of acounterpart connector, is defined as an atmospheric portion of theconnecting terminal connected to the external separated portions.

The lead frame 11 shown in FIG. 4 (a) is formed from a plate made ofcopper alloy having an even thickness, by a mechanical process such as apunching method, and has two external frame portions 111 extendingvertically and two transverse frame portions 112 connected to theexternal frame portions 111.

Each inside portion enclosed by the two external frame portions 111 andtwo transverse frame portions 112 has three internal connectingterminals 113, 114 and 115 connected to one of the external frameportions 111 through a later cut out connecting portion 111a having ashorter length, and 4 external connecting terminals 116, 117, 118 and119 connected to the other external frame portions 111 through a tie bar111b and a heat sink connector 120 connected to the transverse frameportion 112 through a short connecting portion 112a.

These portions such as internal connecting terminals 113, 114, and 115,external connecting terminals 116, 117, 118, and 119, and heat sinkconnector 120 are separated from the external frame portions 111 andtransverse frame portions 112 when the resin sealed monolithic ICportion 13 is formed by a resin whereby each is electrically separatedfrom the other.

The opposite end of each terminal corresponds to each electrode of themonolithic IC 16, respectively, and are bonded thereto.

In this invention, internal connecting terminals 113, 114, and 115 areconnecting terminals electrically connected to an electrical load, forexample, an alternator or a generator, and correspond to the firstconnecting terminal, and the external connecting terminals 116, 117,118, and 119 means are connecting terminals electrically connected to adevice other than the electrical load, which device is locatedseparately from and externally of the load and correspond to the secondconnecting terminals.

Further, an electrically conductive material used in this invention isprovided integrally with the internal connecting terminal 114.

The lead frame 11 of this invention may be treated by a chemicaltreatment such as etching, or the surface thereof may be plated, takingthe solderability and wire-bonding ability thereof into account.

In this invention, a plate that has been already plated also can be usedas the lead frame.

As shown in FIG. 4 (b), after the monolithic IC 16 is fixedly mounted ona predetermined portion of the lead frame 11 by for example, soldering,the opposite end of each connecting terminal and each electrode of themonolithic IC 16 is wire-bonded, respectively.

Then a resin sealed monolithic IC portion 13 is formed by sealing themonolithic IC 16 and at least a portion of the internal connectingterminals 113, 114 and 115 and the external connecting terminals 116,117, 118, and 119, with the resin 13a.

Namely, first, a heat sink 12 made of a metal having a good heatconductivity such as aluminum or copper is fixed inside a first moldingdie, and then a lead frame 11a having a monolithic IC 16 mounted thereonis fixed thereover and a clamping operation performed.

The heat sink 12 of this invention has a rectangular shape havingprojecting portions extended in a longitudinal direction of the shapeprovided with an aperture 121 for fixing a connecting terminal, andfurther, on one of the projecting portions, a step like portion 122 isprovided as shown in FIGS. 6 and 7.

Since the heat sink 12 is fixed inside of the molding die in such a waythat it is in contact with only the heat sink connector portion 120 ofthe lead frame 11, by utilizing the step like portion 122, the heat sink12 is electrically separated from all of the connecting terminals exceptthe heat sink connector portion 120, after the molding operation withresin is carried out and predetermined parts cut off.

After the clamping operation, a certain resin 13a is injected into acavity of the molding die and solidified, and therefore, a lead frame lahaving a resin sealed monolithic IC portion 13 can be obtained as shownin FIG. 5.

Next, the frame portion of this lead frame 1a is cut by using a die.Namely, a boundary portion between each of the internal connectingterminals 113, 114, and 115 and a connecting portion 111a and a boundaryportion between the each external connecting terminals 116, 117, 118 and119 and tie bar 111b, and further, a boundary portion between the heatsink connector portion 120 and the connecting portion 112a, are cut.

In this example, each tip end portion 116a, 117a, 118a, and 119a of theexternal connecting terminals 116, 117, 118, and 119, respectively, maybe pressed in a direction of a thickness of the terminal to make atapered end portion, and both of the end corners located widthwise ofthe terminal may be chamfered as shown in FIGS. 10 and 11. The moldedbody thus obtained is referred to as a first molded body 1b.

On the other hand, on a contacting surface between a resin 13a of aresin sealed monolithic IC portion 13 and a resin 14b for molding aconnector, some projecting portions, for example, rib portions orprojecting lines or the like, are provided to strengthen the contactingsurface by increasing a mutual engaging ability therebetween, as shownin FIGS. 8 and 9.

Then, the first molded portion is fixedly mounted on a second molded dieand clamped, and thereafter, a resin sealed monolithic IC is obtained bya molding method with a resin 14b, as shown in FIGS. 1, 2, and 3.

In this example, the resin sealed monolithic IC and external connectingterminals 116, 117, 118, and 119 are molded by an externally coveringmolding method with the resin 14b, and at the same time as shown inFIGS. 1 and 3, the root portion of the external connecting terminals aresealed with a resin, for improving the moisture proof characteristic.

In the second molded portion Y, each tip end portion 116a, 117a, 118a,and 119a of the external connecting terminals 116, 117, 118, and 119,respectively, are positioned inside a cavity (a concave portion) 14a ofthe connector made of the molded resin 14b.

The resin sealed semiconductor device of this example of this inventioncan be obtained by using a lead frame as described above, andconsequently, the steps for setting each connecting terminal and forcovering a shield case required in a process for making a ordinarydevice having a hybrid construction are eliminated, and the number ofcomponents and the number of steps can be reduced because of apluralilty of these molded bodies can be obtainded simultaneously.

Further, a cutting operation of the lead frame can be carried out easilyand accurately by separately performing a molding process for theconnector housing and a sealing process for the monolithic IC.

In this invention, the cutting off operation for cutting the frameportion from the lead frame, and the molding operation for forming theconnector housing, are carried out after the operation for sealing themonolithic IC, and thus, an advantage can be obtained such that, sincethe root portions of the external connecting terminals 116, 117, 118 and119 are sealed with a resin 14b, the deterioration due to moisture,which used to occurr when the lead frame was cut off, can be effectivelyavoided.

Furthermore, the resin 13a for sealing a monolithic IC and the resin 14bfor molding a connector housing by an external covering molding methodmay be different each to other in this invention. For example, when athermosetting epoxy resin having good moisture proof characteristic,stress proof characteristic, and molding ability is used as the resin13a, and a thermoplastic resin such as PBT (polybutylene telephthalate),PPS (polyphenylenesulfide), and 66-Nylon having a good mechanicalstrength and dimensional stability are used as the resin 14b, asemiconductor package having a good moisture proof characteristic,stress proof characteristic and a good mechanical strength anddimensional stability, can be obtained.

Moreover, as described above, when both the thermosetting resin andthermoplastic resin are used simultaneously, there is less adhesiveforce between these resins and the moisture proof characteristic isusually reduced. Such a defect can be overcome by providing projectingportions 131 on the surface of the resin sealed monolithic IC portion 13and molding with the resin 14b which increases the engagement forcebetween the resins 13a and 14b.

In this invention, the resin used may preferably have, for example, Izodimpact strength of more than 3 kg.f.cm/cm and a bending strength of morethan 8 kg.f/mm².

Accordingly, by obtaining a closer engagement between the resins 13a and14b, the semiconductor package thus obtained has a construction suchthat the intrusion of moisture at an interface between the resins can beavoided, and therefore, the moisture proof characteristic is improved.

On the other hand, instead of using the projecting portion 131, thesurface may be provided with an uneven configuration for obtaining aclose engagement between both resins and increase an interclinchingforce therebetween.

In this example, the external frame portions 111, transverse frameportions 112, connecting portion 111a 112a, and tie bar 111b are cut offafter the resin sealed monolithic IC portion 13 is formed, but these cutoff portions are disposed outside of the resin sealed monolithic ICportion 13, and consequently, when the cutting operation is carried out,the operation does not have an adverse affect on the wire-bondingalready performed, because that the wire-bonded portions are completelysealed off by the resin.

Therefore, the resin sealed semiconductor device of this invention hassuperior moisture proof and mechanical strength characteristics.

On the other hand, as each tip end portion 116a, 117a, 118a, and 119a ofthe external connecting terminals 116, 117, 118, and 119, respectively,are positioned inside a cavity 14a of the connector housing made of themolded resin 14b, an unpreferable condition such that the tip endportion 116a, 117a, 118a, and 119a come into contact with another devicebefore coupling between such tip end portions and an opposite device ofthe connector is completed, or the tip end portions are reverselycoupled with a female adapter of an opposite device of the connector,can be presented.

EXAMPLE 2

The resin sealed semiconductor device produced in this example has thesame construction as that of the device produced in Example 1, with theexception that the lead frame has a different structure from that of thesemiconductor device produced in Example 1.

The lead frame used in this example is shown in FIG. 12.

This lead frame 21 has external connecting terminals 216, 217, 218, and219, which are not connected to the external frame portions 211, but twoof the 4 external connecting terminals 216 and 219 existing outside areconnected to a connecting portion 212b having a long length and extendedfrom the transverse frame portions 212, and further, the externalconnecting terminals 217 and 218 are connected to an external connectingterminal adjacent thereto, respectively, through an intermediateconnecting portion 25. The connecting portion 212b and the intermediateconnecting portion 25 are positioned outside of a resin 23a after theresin sealed monolithic IC portion 23 is formed but are covered by asecond resin when the connector housing is molded with that resin.

In this example, the lead frame is different from that of in Example 1in that each tip end portion 216a, 217a, 218a, and 219a of externalconnecting terminals 216, 217, 218, and 219, respectively, arepreviously fabricated, as shown in FIGS. 10 and 11.

As shown in FIG. 12, after mounting the monolithic IC 26 on the leadframe 21 and wire bonding between the monolithic IC 26 and theconnecting terminals with wires 27 in the same way as in Example 1, themonolithic IC is sealed with a resin 23a together with a heat sink 22.

The lead frame 2a having a resin sealed monolithic IC portion 23 thusobtained is shown in FIG. 13.

Thereafter, by cutting off frame portions of the lead frame 2a andmolding a resin connector housing by the externally covering moldingmethod, the same resin sealed semiconductor device as that of Example 1can be obtained.

Since each tip end portion 216a, 217a, 218a, and 219a of the externalconnecting terminals 216, 217, 218, and 219 are previously fabricated inthe configuration described in Example 1, the resin sealed semiconductordevice of this Example can improve the product yield because it is notnecessary to-fabricate the tip end of each connecting terminal after themonolithic IC is sealed with resin.

Namely, the fabrication process applied to raw materials is superior tothe fabrication process applied to partially fabricated goods form aneconomical point of view and of the occurrence of faulty products.

Further, since the connecting portion 212b having a longer length andextended from the external connecting terminals 216 and 219 to thetransverse frame portions 212 and the intermediate connecting portion 25connecting the external connecting terminals to each other including theterminal 217 and 218, which are to be cut off after the monolithic IC issealed, are covered with the resin by the second molding operation, noresidual portions exist on the terminals, i.e., a small pieces caused bythe cutting, or a burs, over the connecting portion 212 and intermediateconnecting portion 25.

Accordingly, a smoothly sliding coupling action between the terminalsand an external connector (not shown) can be attained.

EXAMPLE 3

The resin sealed semiconductor device produced in this example has thesame construction as that of the device produced in Example 1, with theexception that a lead frame 31 shown in FIGS. 14 and 15 is used.

This lead frame 31 is produced from a copper alloy plate havingdifferent thicknesses, i.e., a thick portion 31a and thin portion 31b,respectively, by a punching method, as shown in FIG. 15.

As shown in FIG. 14, in the lead frame 31, a left hand side of theexternal frame portions 311, a left hand side of the transverse frameportions 312, three internal connecting terminals 313, 314, and 315, aheat sink connector 320, and respective portions of each of the fourexternal connecting terminals 316, 317, 318 and 319 on which the wirebonding with a monolithic IC 36 utilizing a wire has been performed, arethick portions, and the remaining portions i.e., other portions of eachof the four external connecting terminals 316, 317, 318, and 319, aright hand side of the external frame portions 311, and a right handside of the transverse frame portions 312, are thin portions.

In the resin sealed semiconductor device using the lead frame 31produced in this Example, the internal connecting terminals 313, 314 and315 receive stress caused by vibration generated by an electrical loadincluding a resin sealed semiconductor device thereon, or form externalvibration, but, these terminals are not broken because the thickportions thereof allow a stress relaxation thereof.

Further in the device of this example, another advantage is gained inthat a transient heat generated by a power device in a switchingoperation can be radiated.

If a plate made of copper alloy is selected by taking an antistresscorrosion characteristic thereof into account, and if the thickness ofthe thick portion 31a is more than, for example, 1 mm, a burringtreatment in which at least three screw threads having pitches of M4 arereserved can be applied thereto, and further, the connection with theterminals of the opposite side is easily performed.

EXAMPLE 4

FIG. 16 and FIG. 17 show a front plane view and a back plane view of aresin sealed semiconductor device 4 of this Example, respectively, andFIG. 18 shows a cross sectional view taken along a line B--B is of FIG.17.

This resin sealed semiconductor device 4 is characterized in that theexternal connecting terminals are bent at right angle and the connectorhousing has an opening in the same direction as that of the internalconnecting terminals.

A lead frame used in this Example is shown in FIG. 19.

A monolithic IC 46 is mounted on a predetermined portion of the leadframe 41 by, for example, soldering, and a resin sealed monolithic ICportion is formed by molding with a resin 43a together with a heat sink42, after the wire bonding is performed with a wire 47 (FIG. 20).

Then, a first molded body 4b is obtained by cutting off the externalframe portion 411, transverse frame portion 412, and connecting portion412b from the lead frame, as shown in FIGS. 21 and 22.

To make the external connecting terminals 416, 417, 418, and 419 to beat a right angle to the surface on which a resin sealed semiconductordevice 4 is mounted, the external connecting terminals are bent at thedotted line 46, and the first molded body 4b is joined with the secondmolded body 4c as shown in the front plane view and back plane view ofFIGS. 23 and 24, respectively.

Finally, the resin sealed semiconductor device 4 shown in FIG. 16 can beobtained by carrying out an external covering molding method with aresin, to form the connector housing.

The lead frame 41 is made from a copper alloy plate having an eventhickness, by punching, and as shown in FIG. 19, comprises externalframe portions 411, transverse frame portions 412, three internalconnecting terminals 413, 414, and 415, four external connectingterminals 416, 417, 418, and 419, and a heat sink connector 420.

Each tip end portion 416a, 417a, 418a and 419a of the externalconnecting terminals 416, 417, 418, and 419 of the lead frame 41 arepreviously fabricated to a configuration which is the same as that ofthe lead frame 21 used in Example 2, as shown in FIGS. 10 and 11, andfurther, the lead frame 41 also has an intermediate connecting portion45, and thus, since the external connecting terminals 416, 417, 418, and419 are bent at a right angle to the surface on which a resin sealedsemiconductor device 4 is mounted, the configuration around the externalconnecting terminals 416, 417, 418 and 419 is completely changed.

Also, the connecting position and connecting length of the connectingportions connecting the external connecting terminals, external frameportions, and transverse frame portions are changed.

As shown in FIGS. 18 and 24, a tapered portion 432 provided on themonolithic IC 43 is tapered and is provided for making a run off portion442 for a second molded body molded with resin 44b.

In an external connector having a skirt, the run off portion 442 isprovided to prevent interference between the skirt and the connectorhousing 44.

To prevent this interference, the connector housing 44 should beseparate from the first molded body made of resin 43a, but in thismethod, only the length of the device is extended, and therefore, thismethod is not preferable from viewpoint of reducing weight and ofminiaturization.

Accordingly, as shown in Example 4, the run off portion 442 can becreated by providing a tapered portion on the device.

In the resin sealed semiconductor device of this example, as shown inFIGS. 16 and 17, two lightening holes 441 are provided, which are formedafter all of the external connecting terminal 416, 417, 418, and 419 arebent at an angle of 90° in the same direction, and are apertures orpenetrations appearing because patterns of the lead frame do not existon that portion. This allows a saving of materials, reduced costs andweight reduction.

This device has another advantage in that a connector arrangement whichis difficult to realized by using the connector having a directionparallel to the connecting direction, as shown-in FIGS. 1, 2 and 3, canbe realized and the occupied area of the device is smaller than that ofa device having all portions arranged on a plane.

Further, when the resin sealed semiconductor device is integrallymounted on an electric load, as described in this invention, preferablythe occupied area is as small as possible when it is utilized forcompact electrical load.

EXAMPLE 5

In this example, an IC regulator connected to an alternator as anelectric load is explained in more detail.

A perspective view of the IC regulator 5 is shown in FIG. 31.

The external connecting terminals of this IC regulator 5 are bent at anangle of 90°, as in Example 4, and the connector housing has an openingwhich is directed in a direction at a right angle to the internalconnecting terminals, the external connecting terminals being bent inthe same direction in which the heat sink 52 is provided on themonolithic IC, which is opposite the direction in example 4.

Next, a method of producing this Example is explained with reference toFIGS. 25 to 31.

First, a front plane view of the lead frame is shown in FIG. 25.

In this lead frame 51, the internal connecting terminals 513, 514, 515,and 520, and the external connecting terminals 516, 517, 518, and 519are connected to the external frame portions 511 and the transverseframe portions 512, respectively, and further, island portions 514a,520a, and 519a on each of which the monolithic IC's 56a, 56b, and 56care mounted, respectively, the details of which will be explained later,are provided on each end of the internal connecting terminals 514, 520,and 519 respectively.

The island portion 520a is also connected to the internal connectingterminal 513, and therefore, the island portion 520a is supported atboth ends by the terminals.

Lock holes 514b and 513b are provided on the internal connectingterminals 514 and 513, respectively, to increase the adherence forcebetween the resin 53a for a first molded portion and the resin 54b forconnector housing, i.e., second molded portion, each of which will beexplained later, and other lock holes 516b, 517b, 518b, and 519b areprovided on the external connecting terminals 516, 517, 518, and 519,respectively, to increase the adherence force with the resin 53a for thefirst molded portion, which will be explained later.

As shown in FIG. 26, the monolithic IC's 56a, 56b, and 56c are fixed onthe island portions 514a, 520a and 519a by, for example, soldering.

After the wire bonding operation with the wire 57 is completed, themolding operation is carried out over the lead frame 51 together with aheat sink 52 having a configuration as shown in FIG. 28, to obtain aresin sealed monolithic IC portion 5a.

FIG. 27 shows the resin sealed monolithic IC portion 5a in which theheat sink 52 is fixed to a back side of the lead frame 51 and thatportion has ribs 531 provided on the resin 53a to increase the adherenceforce with the resin 54b, as explained later.

Next, the first molded body 5b can be obtained by cutting off theexternal frame portions 511 and the transverse frame portions 512, andother connecting portions from the lead frame 51, as shown in FIG. 29,which shows the back side portion of the body.

Now, the connection portion 513c connecting between the island portion520a and the internal connecting terminal 513 is also cut offsimultaneously.

Furthermore, the external connecting terminals 516, 517, 518, and 519are bent at a right angle to the surface on which the IC regulator 5 ismounted, i.e., a flat surface of the resin 53a, to obtain a secondmolded portion 5c as shown in the perspective view in FIG. 30.

Finally, the IC regulator 5 as shown in the perspective view in FIG. 31,can be obtained by carrying out the externally covering molding methodover that portion with a resin, for example, PBT.

The IC regulator 5 thus obtained is incorporated in an alternator 6through the internal connecting terminals 513, 514, 515, and 520 asshown in the plane view of FIG. 32.

FIG. 32 partially shows a rear side of an alternator 6 with the rearcover removed, in which a rectifier 61 having eight diodes 63 and abrush holder 62 are provided, and the IC regulator 5 is assembled to thealternator 6 by fixing with bolts, which establish an electrical contactbetween the IC regulator 5 and the alternator 6.

An equivalent electric circuit of the IC regulator 5 and alternator 6 isshown in FIG. 33.

In FIG. 33, the same components as those of previous figures are giventhe same numbers.

The alternator 6 comprises a brush holder 62, diodes 63, stator coil 64,and rotor coil 65, and a generated voltage is controlled to apredetermined value by controlling a current of the rotor coil by acontrol circuit 70 of the IC regulator 5 through a transistor 71 and anF terminal.

A charge lamp 81 is turned OFF when the alternator is generating acurrent, a load 82, for example, an electrothermal choke, for increasinga fuel mix ratio in vehicles, for example, which is turned ON when thealternator is generating a current. A battery 83 and a key switch 84 arealso provided.

The IC regulator 5 controls the generation of the alternator 6 bycontrolling the transistor 71 to ON or OFF corresponding to signals of agenerated voltage of the alternator 6 input to the control circuit 70through the terminal B, and the voltage of the battery input to thecontrol circuit 70 through the terminal S.

An output volta V_(G) of one phase of the alternator 6 is input to theIC regulator 5 through the terminal P, and when the voltage V_(G)exceeds a predetermined voltage value V_(A), a low level signal L isoutput on the lines a and b, respectively.

Accordingly, the transistor 72 and 73 is turned ON and OFF,respectively, and therefore, the electric current from the battery 83flows into the load 82 through the terminal IG, transistor 72, and theterminal L.

When the volta V_(G) is lower than the predetermined voltage valueV_(A), a high level signal H is output on the lines a and brespectively, and accordingly, the transistor 72 and 73 is turned OFFand ON, respectively, and therefore, the electric current from thebattery 83 flows through the charge lamp 81, the terminal L, andtransistor 73, causing the charge lamp 81 to turn ON.

Further, since the ON and OFF condition of the transistor 71 is closelyconnected to the generating condition of the alternator 6, this signal,which is already transmitted to the terminal FR through the controlcircuit 70, can be supplied to an Electronic Control Unit (ECU) forcontrolling vehicles, for example.

In this Figure, the terminals B, F, E, and P correspond to the internalconnecting terminals 514, 515, 520, and 513, respectively, and theterminals S, IG, L, and FR correspond to the external connectingterminals 517, 518, 519, and 516, respectively.

The terminal E is grounded and the terminal B is used for supplying thevoltage generated by the alternator 6 to the battery 83.

In this circuit construction, an input impedance of the terminals of thecontrol circuit 70 is set at a high level, since a voltage signal isoutput at the terminals S and FR, and therefore, a connector housingcovering the external connecting terminals is provided by externallycovering molding operation to prevent a variation in voltage caused by aleak current, for example.

Further, a connector housing can not be formed on the side of theinternal connecting terminals since it must be connected to thealternator 6 mechanically and electrically, and therefore, the ends ofthe internal connecting terminals are fabricated into a configurationwhich enables them to be directly fixed to the load by, for example,thread tightening.

Consequently, at the terminal F or the like in which a leak current canbe more or less ignored if it flows in the terminal, an offset operationis not required, but at a terminal in which a leak current flow can notbe ignored, the offset for leak current is applied by setting the inputimpedance at a low level.

According to this example, the number of components and the number ofproduction steps can be reduced, and an IC regulator having a morecompact size can be provided, as in Example 4. Further, in this Example,as the extended external connecting terminals 516, 517, 518, and 519 arebent to the direction of the side where the heat sink 52 is located, thecontacting area between the resin 53a and the resin 54b becomes large atthe side opposite to the heat sink 52, as shown in FIG. 34, without anydeterioration of the heat radiation performance thereof.

When an opposite connector portion having a female adapter is insertedinto the connector housing made of the resin 54b, a pressing forceoccurs as shown by an arrow P in FIG. 34, but this force producesanother force P1, which presses the resin 54c arranged under the resin53a onto the resin 53a through a fulcrum f, amd thus the resin 54b isbent, and accordingly, the reliability of the adhesion between the resin53a and the resin 54b is enhanced.

In the example described above, embodiments of this invention areexplained by a method in which a process of sealing the monolithic ICand a connector molding process are carried out in separate steps, andhereafter, other embodiments of this invention in which both processescan be carried out simultaneously in one step will be explained.

The lead frame used in this embodiment is different from that used inprevious Examples.

Namely, this lead frame is provided with a frame portion such that firstconnecting terminals are connected to the frame portion through acutting portion and second connecting terminals are connected to theframe portion through an intermediate connecting portion, and whenmolding occurs, parts of the intermediate connecting portions are notcovered with resin, and the intermediate connecting portions are thencut off when a cutting operation is carried out, to be eliminated fromthe frame portion.

EXAMPLE 6

A plane view of a semiconductor device 600 made in this example is shownin FIG. 35-A. This device is produced in such a way that, first amonolithic IC is wire bonded to the lead frame 61, a plane view of whichis shown in FIG. 36, and then the lead frame 61 is inserted into amolding die with a heat sink 620, and thereafter, a molding operation iscarried out to make a molded body, a plane view of which is shown inFIG. 37, and finally, the device is cut off from the lead frame. Thelead frame 61 is made from a plate made of copper alloy having an eventhickness, by punching, and as shown in FIG. 36, two external frameportions 611 extending vertically and a plurality of transverse frameportions 612 coupling with the external frame portions are provided.

In an inner portion enclosed by the two adjacent external frame portions611 and two adjacent transversal frame portions 612, three internalconnecting terminals 613, 614, and 615 connected to the external frameportions through a later cut short connecting portion 611a, fourexternal connecting terminals 616, 617, 618, and 619 connected to theexternal frame portion 611 through a tie bar 611b and a heat sinkconnector 620 connected to the transverse frame portion 612 through ashort connecting portion 612a, are provided.

The two outermost external connecting terminals 616 and 619 are alsoconnected to a connecting 612b having a longer length and extended fromeach of the transverse frame portions 612..

Each connecting terminal of the lead frame and each electrode of the ICare wire bonded, respectively, and then a heat sink 620 made of a metalhaving a superior heat conductivity, such as aluminum or copper is firstinserted into a molding die, and thereafter, the lead frame 61 having anIC mounted thereon is inserted and a clamping operation is carried out.

In this case, the heat sink 620 has a rectangular confirmation with twoprojecting portions each projected from a short side thereof, with anaperture 621 for fixing same to a load provided thereon, as shown inFIG. 35-B, and has a step like portion 622 on one of the projectingportions as shown in FIG. 35-C.

This step like portion has the same function as stated in previousexamples. Thereafter, a molding operation for fabricating a moldedportion over the IC with a connector housing 630 is carried out byinjecting a resin into a cavity of the molding die and then solidifyingthe resin to make a molded body in which a connector housing 630 isintegrated with the lead frame 611, as shown in FIG. 37, is carried out.

Then, a semiconductor device is obtained by cutting the portions 611aconnecting the external frame portion 611 of the lead frame and eachinternal connecting terminal 613-615, the portion 612a connecting a heatsink connector 640 and a transverse frame portion 612, a boundaryportion between each external connecting terminal 616-619 and a tie bar611b and a projecting portion of the connecting portion 612b projectedfrom the connector housing 630, and the connecting portion 612bconnecting each transverse frame portion 612 and an outer portion of theexternal connecting terminals 616 and 617, by a cutter.

A semiconductor device of this example is produced in one step ofsealing the IC and molding a connector housing.

Therefore, the number of step in the process is reduced and the processper se is simplified. Further, this device has a water proofconstruction because the IC is integrally embedded inside the connectorhousing 630.

Moreover, since the external connecting terminals 616-619 are disposedinside a cavity 630a of the connector housing 630, and therefore, eachtip portion thereof does not project from the connector housing 630,short circuits caused by the intrusion of a foreign substance into theconnecting portion, are prevented. The open portion of the cavity 630aretaining the external connecting terminals 616-619 therein is molded insuch a way that the open area is gradually expanded in an outwarddirection, and thus an opposite connector (not shown) can be easilyinserted therein.

In this example, instead of providing a step like portion on the heatsink 620, the same effect as above can be obtained by providing a steplike portion on a heat sink connector on a lead frame 61.

Further, instead of providing a specific step like portion, a process offixedly adhering a heat sink 62 having a insulating layer, such as alayer produced by an anodic oxidation method, with a lead frame byutilizing an adhesive having a good heat conductivity, or a process inwhich a heat sink 620 and a lead frame 61 are inserted into a moldingdie while interposing an insulating film having high heat conductivitytherebetween, and thereafter, carrying out the molding, may be adoptedto obtain the same effect.

EXAMPLE 7

A plane view of a semiconductor device made in this Example 7 is shownin FIG. 38. This device 700 is produced in such a way that, first an IC(not shown) is wirebonded to a lead frame 721 as shown in FIG. 39, andthe lead frame 721 and a heat sink 722 are clamped in a molded die, andthereafter, molded to produce a molded body, a plane view of which isshown in FIG. 40, and finally, is cutoff.

In this semiconductor device 700, a drawback in that it is relativelydifficult to cut off the external connecting terminals 616-619 of thesemiconductor 6 from a lead frame 61 shown in FIG. 35 in Example 6, iseliminated.

The lead frame 721 is fabricated from a plate made of copper alloyhaving an even thickness, by punching, and has a configuration as shownin FIG. 39, wherein an external frame portion 711, a transverse frameportion 712, three internal connecting terminals 713, 714, and 715, fourexternal connecting terminals 716, 717, 718, and 719, and a heat sinkconnector 720, are provided.

This lead frame is generally the same as that in Example 6, but isdifferent in that the external connecting terminals 716-719 are notconnected to the external frame portion 721 and the tip portions thereofare previously fabricated, and further, two inside external connectingterminals 717 and 718 are connected to an inner connecting terminals 714through an intermediate connecting portion 76 having a T shape. The twooutside external connecting terminals 716 and 719 are connected to theconnecting portion 722b and the transverse frame 712, respectively, asshown in FIG. 39.

It is also different from the heat sink of Example 6 that a heat sink722 of this Example has a concave portion 732 on one of the long sidesthereof.

Further, a molding die used in this example, not shown, is alsodifferent from that used in Example 6, in the configuration of thecavity for molding the intermediate connecting portion 76 and a portionwhereat the tip portions of the external connecting terminals aresurrounded.

Each connecting terminal of this lead frame 721 is wirebonded with anelectrode of the IC, and thereafter, the lead frame with the IC and aheat sink 722 are inserted into a molding die in the same manner as inExample 6, and then a resin is injected into a cavity of the die and theresin is soldified to make a molded body with a connector housing 723.

Thus the molded body in which a lead frame 721 is integrated with aconnector housing 723 as shown in FIG. 40 can be obtained. An aperturedportion 7a is provided on a center portion of the connector housing 723,and the intermediate connecting portion 76 appears in this aperture.

The external connecting terminals 716-719 are retained inside a cavity73a of the connector housing 723, and thereafter, in the same manner asin Example 6, the frame portions 711, 712, 722b and the intermediateconnecting portion 76 are cut off, and therefore, the semiconductordevice 700 having a aperture 7a as shown in FIG. 38 can be obtained. Bycutting off the intermediate connecting portion 76, the internalconnecting terminal 714 and the external connecting terminals 717, 718are electrically separated and insulated.

Further, preferably the ends of the external connecting terminals 717,and 718 caused by the cutting operation and appearing on the inner wallof the aperture 7a, and the ends of the portion connected to theexternal connecting terminals 716 and 719 caused by a cutting operatingand appearing on the outer surface of the side wall of the molded resin723, are sealed by a sealing material such as a silicone resin oralkydresin, to make a sealed portion 77 and thus improve thewater-proofing. This sealing operation may be applied on the afterportion where the terminal portions unnecessarily appear on the surfaceof the connector housing, and is not restricted only to the intermediateconnecting portion.

In the semiconductor device of this example, a lead frame having theexternal connecting terminals 716-719 the tip ends of which arepreviously fabricated into a predetermined shape, is used, andtherefore, the cutting operation for cutting the tip ends of theexternal connecting terminals is not required when the connector housingis cut off from the lead frame. Moreover, the cutting operation forcutting the intermediate connecting portion can be carried outsimultaneously with the cutting off of the lead frame. Accordingly thesemiconductor device in this Example is more easily produced than thatof Example 6.

In the above, the invention is explained by Examples 1 to 7, but thisinvention is not restricted to these Examples, various variations asdescribed hereunder can be considered, as long as they do not falloutside of the scope of this invention.

(1) In an electric conductive material on which the monolithic IC ismounted, the external connecting terminals, and the internal connectingterminals may be formed as a separate portions, not as an integratedbody.

(2) Where there is no need to control the charge lamp 81 and a load 82through a plurality of external connecting terminals, as in Example 5,preferably at least one terminal (S terminal) for inputting the batteryvoltage, for example, is provided, and conversely, if an input andoutput of more signals to and from the external connecting terminals isrequired preferably a water proof connector having more than fiveterminals is provided.

(3) When the resin sealed semiconductor device of this invention is usedas an IC regulator as shown in Example 5, the electric load to becontrolled may be a DC generator (dynamo) as well as the alternator 6.

(4) As a method for producing the resin sealed semiconductor device, thesequential process thereof is not restricted only to that described inthe Examples, i.e., ○1 forming a resin sealed monolithic IC portion, ○2cutting off frame portions from a lead frame, ○3 forming a connectorhousing, but another sequence such as ○1 forming a connector housing, ○2cutting off frame portions from a lead frame, and ○3 forming a resinsealed monolithic IC portion, may be adopted, and in such a case, whenforming the connector housing, the electric conductive materials onwhich the monolithic IC is mounted, the external connecting terminals,and the internal connecting terminals are fixed after the housing isformed.

(5) As the resin for sealing the monolithic IC and for molding theconnector housing a combination of resins such as a PPS resin includingsilica, for example, as a filler which is not an increase in the meltingviscosity, and a PPS resin including a glass fiber, for example, may beused as the thermosetting resin and the thermoplastic resin mentionedabove.

Note, preferably the resin for sealing the monolithic IC is a resinhaving a low melting viscosity such that the resin does not produceextreme deformation of the wiring connected between the monolithic ICand the connecting terminals, and does not cut these wires when themolding operation is carried out.

The resin for molding the connector housing must have a certainmechanical strength after the molding operation, to protect theconnecting terminals.

(6) This invention can be applied to an igniter or the like having aconnector housing formed by the externally covering molding operation,in the same manner as in these Examples, other than the IC regulatorused in these Examples.

EFFECTS OF THE INVENTION

As described above, in accordance with this invention, since the moldingof the monolithic IC and the connector housing are performed with thefirst resin and the second resin, respectively, it is not necessary forthe second connecting terminals to have a special configuration to becut off.

Further, according to the construction of this invention, a lead framecan be used, and consequently, it the number of components and thenumber of process steps can be reduced.

Moreover, the resin can be selected to correspond to a requiredfunction.

According to the invention, the molded product with the resin having theadvantages of the respective resin used can be obtained.

Further, the moistureproof characteristic of the device can be improved.

Moreover, the adhesive force between the first resin and the-secondresin can be strengthened, and the reliability of the adhesion betweenthe first resin and the second resin can be further improved.

According to this invention, as the resin sealed semiconductor device isformed by using a lead frame, the number of components and the number ofprocess steps can be reduced, and moreover, by separating the process ofsealing the monolithic IC and the process of molding the device by anexternally covering molding method, the cut off of the frame portionsfrom the lead frame can be carried out very easily, and consequently,the fabricate flexibility of the lead frame is increased.

We claim:
 1. A method of producing a resin molded IC regulatorcomprising:forming a lead frame, in which at least a first connectingterminal electrically connected to an electrical load and a secondconnecting terminal electrically connected to a device other than saidelectrical load are connected to a frame portion thereof, out of a platemade of an electric conductive material, mounting a monolithic ICcontrolling an operation of said electrical load on a conductive memberand electrically connecting said monolithic IC to said lead frame,completely sealing said monolithic IC mounted on said conductive memberand partially sealing at least a portion of said first and secondconnecting terminals electrically connected to said monolithic IC, witha first resin having an electrical insulating characteristic to make afirst molded portion, so that said first and second connecting terminalsare rigidly fixed thereby, separating said frame portion from said leadframe and making a second molded portion by an externally coveringmolding operation to cover at least a portion of said first moldedportion and surround said second connecting terminal in such a way thatsaid second connecting terminal is disposed inside a cavity provided onsaid second molded portion, with a second resin having an electricinsulating characteristic.
 2. A method of producing a resin molded ICregulator according to claim 1, wherein said step for making a secondmolded portion comprises a step of forming a connector portionintegrally molded with said second molded portion having a cavitytherein, the second connecting terminal being surrounded thereby.
 3. Amethod of producing a resin molded IC regulator according to claim 1,wherein the step of sealing with said first resin is performed beforethe step of separating said frame portion from said lead frame, and thestep of making said second molded portion with said second resin isperformed after the step of separating said frame portion from said leadframe.
 4. A method of producing a resin molded IC regulator according toclaim 1, wherein the step of making said second molded portion with thesecond resin is a process for molding resin by an externally coveringmolding operation to cover at least a portion of said first moldedportion with a portion surrounding said second connecting terminaltherewithin, and for sealing at least a portion of said first connectingterminal and second connecting terminal and performed before the step ofseparating said frame portion from said lead frame, and the step ofsealing said monolithic IC with said first resin to make said firstmolded portion is performed after the step of separating said frameportion from said lead frame.
 5. A method of producing a resin molded ICregulator according to claim 3, wherein said first resin and said secondresin are the same kind of resin.
 6. A method of producing a resinmolded IC regulator according to claim 3, wherein said first resin andsaid second resin are different kinds of resin.
 7. A method of producinga resin molded IC regulator according to claim 3, wherein said firstresin and said second resin are different in mechanical strengthrepresented by one of Izod impact strength and a bending strength.
 8. Amethod of producing a resin molded IC regulator according to claim 6,wherein said second resin has the higher mechanical strength than thatof the first resin.
 9. A method of producing a resin molded IC regulatoraccording to claim 6, wherein said first resin is made of athermosetting resin and said second resin is made of a thermoplasticresin.
 10. A method of producing resin molded IC regulator according toclaim 9, wherein said second resin is molded in such a way that saidsecond resin covers at least a portion of said first molded portion ofsaid first resin to be held by said second resin.
 11. A method ofproducing resin molded IC regulator comprising:forming a lead frame, inwhich at least a first connecting terminal electrically connected to anelectric load and a second connecting terminal electrically connected toa device other than said electric load are connected to a frame portionthereof, out of a plate made of electric conductive material, mounting amonolithic IC controlling an operation of said electric load, on aconductive member and electrically connecting said monolithic IC to saidlead frame, sealing over all said monolithic IC completely and at leasta portion of said first and second connecting terminals partially, withelectric insulating resin, so that, said first and second connectingterminals are rigidly fixed thereby and simultaneously making a moldedportion having a connector portion provided with a cavity portion withwhich said second connecting terminal is surrounded and integrated withsaid sealing portion, and separating said frame portion from said leadframe.
 12. A method of producing a resin molded IC regulator accordingto claim 11, wherein a tip end of said second connecting terminal isdisposed inside of a cavity provided in said molded portion surroundingsaid terminal.
 13. A method of producing a resin molded IC regulatoraccording to claims 1 or 11, wherein said lead frame has a configurationsuch that said second connecting terminal is connected to said leadframe through a connecting portion connected between said frame and aportion of said second connecting terminal except a tip portion thereofand the sealing operation or the molding operation is carried out insuch a way that said connecting portion remain outside of said sealed ormolded portion, and the separating operation is carried out byseparating said connecting portion.
 14. A method of producing a resinmolded IC regulator according to claims 1 or 11, wherein said lead framehas a configuration such that two outermost of said second connectingterminals are connected to said lead frame through a connecting portionconnected between said frame and a portion of the second connectingterminal except for a tip portion thereof, and other inner secondconnecting terminals are connected to one of the first connectingterminals through an intermediate connecting portion connected to aportion of said second connecting terminal except for a tip portionthereof, and the sealing operation or the molding operation is carriedout in such a way that said connecting portion remains outside saidsealed or molded portion and the separating operation is carried out byseparating said connecting portion and said intermediate connectingportion.
 15. A method of producing a resin molded IC regulator accordingto claim 14, wherein said sealing operation or molding operation iscarried out in such a way that said connecting portion remains outsideof said sealed or molded portion and said intermediate connectingportion is inside of an aperture provided on said sealed or moldedportion, and the separating operation is carried out by separating saidconnecting portion and said intermediate connecting portion appearinginside said aperture.